Addition one part curing type heat-conductive silicone grease composition
US10030184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2016 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Oct 15, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Addition one-part curing-type heat-conductive silicone grease composition containing: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50-100,000 mPa·s at 25° C.; (B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, having no R2SiO unit, having no silicon-bonded hydrogen atom at any terminal end, having the silicon-bonded hydrogen atoms only in a side chain or chains, and being in a substantially straight chain form, in an amount such that the ratio of {the number of Si—H groups}/{the number of alkenyl groups in the composition} is 0.1-5.0; (C) a photoactive-type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25° C. of 30-800 Pa·s as measured by a Malcom viscometer at a rotational speed of 10 rpm. The composition has high shape-retention properties, is low in hardness, and can be stored at normal temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.