Patent · US Active

Sputter tool

US10030303B2 · kind B2 · utility

0Cited by

0References

19Claims

0Family size

Assignees

SUNPOWER CORPORATION · US
TOTAL MARKETING SERVICES · FR

Inventors

Yu-Chen Shen · Sunnyvale, US
Taiqing Qiu · Los Gatos, US
Robert Woehl · San Jose, US
Kieran Mark Tracy · San Jose, US
Mukul Agrawal · San Jose, US

Key dates

Filing date	Dec 19, 2014
Grant date	Jul 24, 2018
Priority date	—
Expiry date	Mar 17, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/32715
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Sputter tools are described. In one embodiment, an apparatus to support a wafer includes a pallet having a depression to receive the wafer. The pallet includes an opening below the depression, and an edge in the depression is to support the wafer over the opening. A cover at least partially covers the opening. In one example, the cover may be a plate with one or more holes, and a pipe may be located below each of the holes in the cover. In one embodiment, a wafer-processing system includes a processing chamber and a pallet with a depression to receive a wafer. The pallet has an opening below the depression, and an edge in the depression supports the wafer over the opening. In one such embodiment, a cover at least partially covers the opening. According to one embodiment, an energy-absorbing material is disposed below the opening in the pallet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.