Machined film holes
US10030524B2 · kind B2 · utility
1Cited by
46References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2014 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Aug 24, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2260/941
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A component comprises a set of thin film cooling holes formed therein. Each of the thin film cooling holes provides a passage between a first surface of the component and a second surface of the component. Each of the thin film cooling holes includes a smooth transition between the first surface of the component and the surface the passage, and a progressively steeper flow path relative to the first surface of the component and between the smooth transition and the second surface of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.