Fluid flow channel for enhanced heat transfer efficiency
US10030916B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2014 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jul 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.