Tool-less and reusable heat spreader
US10031563B2 · kind B2 · utility
0Cited by
16References
15Claims
0Family size
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Key dates
| Filing date | Aug 18, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Dec 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4068
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first section having a flexible thermal interface material for engaging either side of the electrical computing component; and a rigid heat shield pivotally connected to the first section, the rigid heat shield pivoting between one of a first position and a second position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.