Semiconductor structure including a thermally conductive, electrically insulating layer
US10032690B2 · kind B2 · utility
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5References
24Claims
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Key dates
| Filing date | Feb 24, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Feb 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/87
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive and electrically insulating layer is provided over a semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.