Patent · US Active

Encapsulating material, encapsulating cover plate, sintering equipment, sintering method, and display apparatus

US10033011B1 · kind B1 · utility

1Cited by

0References

9Claims

0Family size

Assignees

BOE Technology Group Co., Ltd. · CN
Ordos Yuansheng Optoelectronics Co., Ltd. · CN

Inventors

Jingjing Chen · Fuzhou, CN
Liang Zhang · Beijing, CN
Fuyi Cui · Beijing, CN
Lina Wang · Beijing, CN
Xuewei Li · Beijing, CN

Key dates

Filing date	Apr 13, 2017
Grant date	Jul 24, 2018
Priority date	—
Expiry date	Apr 13, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10K59/12
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

Embodiments of this disclosure provide an encapsulating material, an encapsulating cover plate, a sintering equipment, a sintering method, and a display apparatus, and relate to the technical field of display. This encapsulating material comprises a leveling auxiliary material, wherein the leveling auxiliary material is used to move upon excitation so as to level the encapsulating material when the encapsulating material is subjected to sintering, and is thus used in the encapsulation of a cover plate to be encapsulated and an encapsulating cover plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.