Systems and methods for device temperature stabilization
US10033354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jun 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature stabilized device and method for temperature stabilization are provided. The temperature stabilized device comprises a substrate having a first surface, at least one component mounted on the first surface of the substrate, and a first conformal layer comprising a thermoelectric material, with the first conformal layer over the at least one component. A first temperature control circuit is electrically coupled to the first conformal layer. The first temperature control circuit is configured to control a current through the first conformal layer. The current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.