Headset porting
US10034086B2 · kind B2 · utility
3Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2014 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jan 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/1083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headset includes at least one ear cup having front and rear cavities separated by a driver. The cup includes a pressure equalization port coupling the front cavity to space outside the cup, the pressure equalization port having a cross-sectional area greater than 2 mm2 and being significantly longer than it is wide, providing a principally reactive acoustic impedance, such that the pressure response of the front cavity including the port to signals input via the driver may be effectively linear over a wide range of pressure levels within the front cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.