Flying tail type rigid-flexible printed circuit board
US10034368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2016 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Oct 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/429
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.