Electronic device and method for manufacturing electronic device
US10034380B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2017 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jun 1, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.