Device with heat transfer portion
US10034412B2 · kind B2 · utility
2Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jan 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A subsea electronic device includes a housing, a chassis within the housing to which one or more electronic cards are mounted and heat transfer sections in thermal contact with the electronic cards. The heat transfer sections are in interference fit with an inner surface of the housing thereby to transfer, in use, heat from the electronic cards through the heat transfer sections to the housing. There is also a subsea electronic device housing and a method of assembling a subsea electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.