MEMS component including a diaphragm element which is attached via a spring structure to the component layer structure

US10035696B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Fabian Purkl · Gerlingen, DE
• Michael Stumber · Ditzingen, DE
• Ricardo Ehrenpfordt · Gerlingen, DE
• Rolf Scheben · Stuttgart, DE
• Benedikt Stein · Stuttgart, DE
• Christoph Schelling · Stuttgart, DE

Key dates

• Filing date: Jul 19, 2016
• Grant date: Jul 31, 2018
• Expiry date: Aug 24, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/003
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.