Patent · US Active

Capacitive sensor comprising integrated heating element

US10036657B2 · kind B2 · utility

6Cited by

9References

20Claims

0Family size

Assignee

MICRO-EPSILON-MESSTECHNIK GMBH & CO. KG · DE

Inventors

Norbert Reindl · Fürstenzell, DE
Manfred Wagner · Triftern, DE

Key dates

Filing date	Jul 4, 2014
Grant date	Jul 31, 2018
Priority date	—
Expiry date	Jul 4, 2034

Classification

Technology area (CPC G)Physics
CPC primaryG01D5/24
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to a sensor element (1) of a capacitive sensor consisting of two or more layers of a substrate (2), the electrodes (3) of the sensor being inserted between said layers. The sensor element is characterized in that a heating element (5) is integrated into said sensor element (1).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.