Ultrasonic sensor with bonded piezoelectric layer

US10036734B2 · kind B2 · utility

Assignee

• SnapTrack, Inc. · US

Inventors

• Leonard Eugene Fennell · San Jose, US
• Nicholas Ian Buchan · San Jose, US
• David William Burns · Minneapolis, US
• Kostadin Dimitrov Djordjev · Los Gatos, US
• Stephen Michael Gojevic · Lockport, US
• Jack C. Kitchens · Tonawanda, US
• John K. Schneider · Williamsville, US
• Nathaniel Robert Bennett · Menlo Park, US
• Kristopher Andrew Lavery · San Jose, US

Key dates

• Filing date: Jun 2, 2014
• Grant date: Jul 31, 2018
• Expiry date: May 23, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/42
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit. Methods of forming ultrasonic sensors include bonding piezoelectric receiver layers to TFT arrays.