Semiconductor device
US10037391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2015 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Nov 19, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/1659
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided with a plurality of semiconductor chips, each of which simulates interactions between nodes of an interaction model, and an inter-chip wire, wherein the plurality of semiconductor chips are used to simulate interactions between nodes of a single interaction model; each semiconductor chip includes a connection unit that sends and receives some of the values indicating the state of the nodes, which are retained by a necessary element unit, via inter-chip wire to and from another semiconductor chip or sends and receives the values indicating state of the nodes, which are retained by the necessary element unit to and from the other semiconductor chip while sharing the inter-chip wire by means of time sharing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.