Patent · US Active

Underfill stop using via bars in semiconductor packages

US10037900B1 · kind B1 · utility

0Cited by

1References

7Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Ernst Seler · Munich, DE
Jorn Isaksen · Munich, DE
Shamsuddin Ahmed · Guelph, CA
Ralf Reuter · Landshut, DE

Key dates

Filing date	May 9, 2017
Grant date	Jul 31, 2018
Priority date	—
Expiry date	May 9, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15151
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device is disclosed. The device includes a baseboard including a first set of metallic contact pads, a semiconductor integrated chip (IC) package including a second set of metallic contact pads and metallic interconnects to connect the first set of metallic contacts pads and the second set of metallic contact pads through metallic interconnects. The second set of metallic contact pads includes a first group of contact pads and a second group of contact pads. The first group of contact pads are designed to carry a high frequency signal. The baseboard includes a plurality of holes that at least partially segregates a first group of metallic interconnects that connects the first group of contact pads to the baseboard and a second group of metallic interconnects that connects the second group of contact pads to the baseboard.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.