3D-microstrip branchline coupler

US10037931B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Barbara S. DeWitt · South Burlington, US
• Essam Mina · South Burlington, US
• B M Farid Rahman · West Columbia, US
• Guoan Wang · South Burlington, US

Key dates

• Filing date: Aug 4, 2017
• Grant date: Jul 31, 2018
• Expiry date: Aug 4, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q13/106
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture. The structure includes a plurality of through silicon vias and conductive lines electrically connected to a first end and a second end of respective ones of the plurality of through silicon vias. A first through silicon via of the plurality of through silicon vias forms a first port of a three dimensional (3D) branchline coupler. A second through silicon via of the plurality of through silicon vias forms a second port of the 3D branchline coupler. A third through silicon via of the plurality of through silicon vias forms a third port of the 3D branchline coupler. A fourth through silicon via of the plurality of through silicon vias forms a fourth port of the 3D branchline coupler.