Barrier assembly with encapsulant and photovoltaic cell
US10038111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2011 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Jul 8, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31667
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.