Integrated circuits and transponder circuitry with shared modulation capacitor for 3D transponder uplink modulation
US10038579B1 · kind B1 · utility
5Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2017 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Mar 15, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG07C9/00309
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Disclosed examples include multichannel RF transponder circuits with multiple transponder channel circuits individually connected to a corresponding antenna circuit, a configurable shared modulation capacitor, a channel switching circuit to selectively connect the modulation capacitor to a selected transponder channel circuit, and a modulation circuit to selectively change the capacitance value of the modulation capacitor between two or more values according to a modulation control signal to transmit uplink data using the selected transponder channel circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.