Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
US10039194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2013 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.