Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures
US10039195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2015 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Oct 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.