Molded card guide chassis
US10039203B2 · kind B2 · utility
0Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2016 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Jul 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis to receive a line replaceable module including a molded body formed from a composite material, a card guide integrally formed in the molded body to receive the line replaceable module, the card guide including a card guide wall integrally formed in the molded body and extending outwardly from the molded body, and a plurality of tolerance features disposed within the card guide to retain the line replaceable module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.