Structure for transferring heat in devices
US10039209B1 · kind B1 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2016 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Jun 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described are techniques for controlling the transfer of heat on various portions of a device or other structure. A structure may include a substrate having a first thermal conductivity. A material having a different thermal conductivity is distributed on the substrate. The position, quantity, and thickness of the material affects the manner in which heat is transferred away from at least one hot spot on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.