Heat spreader and power module
US10039214B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2015 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Dec 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a heat spreader and a power module. The heat spreader comprises: a base plate comprising a first surface and a second surface opposite to the first surface; an insulating frame fixedly connected to the first surface of the base plate; and an insulating material attached to at least a part of a surface of the insulating frame. The present disclosure can effectively satisfy design requirements for both heat dissipation and insulation, and significantly increase a layout space for a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.