Molded electronic structures in body-mountable devices
US10039447B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2013 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jun 9, 2036 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/12
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Molded electronic structures configured for use in body-mountable devices and methods for embedding molded electronic structures in a body-mountable device are described. An example method may include molding an electronic structure to have first curvature corresponding to a first radius of curvature. The electronic structure may include an antenna, a sensor, and an electronic device. The example method may also include adhering the molded electronic structure to a first polymer layer. The example method may additionally include forming a second polymer layer over the molded electronic structure adhered to the first polymer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.