Microminiature chainmail interface between skin and a transcutaneous prosthetic device and a method of manufacture
US10039651B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2016 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jan 14, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The disclosure describes a direct skeletal attachment (DSA) device including a micro-miniature chainmail skin-to-DSA interface. The interface comprises various porous architectures for skin ingrowth and integration as barriers against pathogens. Failure of skin-to-DSA interfaces can occur due to mismatches in mechanical compliance between pliable skin and more rigid DSA interfaces. To address this problem, in embodiments disclosed herein is an interface having a gradient in mechanical compliance or link mobility, ranging from fully flexible, to less compliant, to rigid where it attaches to the main DSA body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.