Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same
US10040140B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2014 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jun 13, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/0056
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.