Patent · US Active

Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

US10040981B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Luca Marchese · Arese, IT
Fabio Ticozzelli · Goldkronach, DE
Ruediger Butterbach · Essen, DE
Judith Siepenkothen · Ratingen, DE
Juergen Foell · Goldkronach, DE
Fabio Angelo Spada · Carate Brianza, IT

Key dates

Filing date	Jul 31, 2015
Grant date	Aug 7, 2018
Priority date	—
Expiry date	Apr 21, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J153/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing covalently bound organic acid anhydride groups to the polymer chain, wherein the polyamide has an amine number from 0.2 to 10 and the olefin copolymer has an acid number from 1 to 100.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.