Pb-free copper alloy sliding material
US10041148B2 · kind B2 · utility
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Key dates
| Filing date | Jul 23, 2012 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jul 14, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2204/12
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.