Heat pump and method for pumping heat in a free cooling mode
US10041708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2014 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Nov 28, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/12
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump includes an evaporator with an evaporator inlet and an evaporator outlet; a compressor for compressing operating liquid evaporated in the evaporator; and a condenser for condensing evaporated operating liquid compressed in the compressor, wherein the condenser includes a condenser inlet and a condenser outlet, wherein the evaporator inlet is connected to a return from a region to be heated, and wherein the condenser inlet is connected to a return from a region to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.