Patent · US Active

Heat pump and method for pumping heat in a free cooling mode

US10041708B2 · kind B2 · utility

9Cited by
4References
31Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 14, 2014
Grant dateAug 7, 2018
Priority date
Expiry dateNov 28, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02B30/12
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A heat pump includes an evaporator with an evaporator inlet and an evaporator outlet; a compressor for compressing operating liquid evaporated in the evaporator; and a condenser for condensing evaporated operating liquid compressed in the compressor, wherein the condenser includes a condenser inlet and a condenser outlet, wherein the evaporator inlet is connected to a return from a region to be heated, and wherein the condenser inlet is connected to a return from a region to be cooled.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.