Thermal conductivity measurement of anisotropic substrates
US10041894B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2015 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | May 30, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K17/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Determining an in-plane thermal conductivity of anisotropic materials, such as display stacks, printed circuit boards (PCBs), and composite housings, includes heating a first region of an anisotropic sample, cooling a second region of the sample, and measuring temperature at a first location between the first region and the second region and a second location between the first region and the second region. The in-plane thermal conductivity of the sample is computed based at least in part on the temperature at the first location, the temperature at the second location, the distance from the first region to the second region, a thickness of the substantially planar anisotropic substrate, and an amount of heat applied to the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.