Heat-insulation material and production method thereof
US10042092B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2017 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jul 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/062
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation material. Yet further disclosed is a method for producing the heat-insulation material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.