Electronic device packages and methods
US10043052B2 · kind B2 · utility
28Cited by
162References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2012 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jul 31, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Electronic devices are described which are adapted and configured to incorporate a fingerprint sensor within a recess or aperture, formed or molded in the housing, such that the fingerprint sensor interface is within 500 microns of an exterior surface of the device. Methods of use and manufacture are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.