Local semiconductor wafer thinning
US10043676B2 · kind B2 · utility
0Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2015 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Oct 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic device built on or in the front side of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.