MEMS grid for manipulating structural parameters of MEMS devices
US10043704B2 · kind B2 · utility
0Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2017 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Feb 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.