Semiconductor package devices integrated with inductor
US10043745B2 · kind B2 · utility
1Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.