Electronic device
US10043755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2015 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Jun 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/981
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a first wiring substrate and a semiconductor device mounted on the first wiring substrate. The semiconductor device includes a second wiring substrate having a plurality of terminals, a plurality of first semiconductor chips mounted on the second wiring substrate, and a second semiconductor chip mounted on the second wiring substrate. The first wiring substrate includes a first power supply line and a second power supply line supplying a plurality of power supply potentials, whose types are different from each other, to the second semiconductor chip. In a plan view, the second power supply line is arranged to cross over a first substrate side of the second wiring substrate and a first chip side of the second semiconductor chip. In a plan view, the first power supply line is arranged to pass between the second power supply line and a part of the plurality of first semiconductor chips and to extend toward a region overlapping with the second semiconductor chip. An area of a region of the first power supply line, the region overlapping with the second power supply line in a thickness direction, is smaller than an area of another region of the first power …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.