HV-LED module having 3D light-emitting structure and manufacturing method thereof
US10043850B2 · kind B2 · utility
3Cited by
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15Claims
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Key dates
| Filing date | Mar 18, 2016 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Sep 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.