Package method of OLED substrate and OLED package structure
US10043861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2016 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Oct 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
The present invention provides a package method of an OLED substrate and an OLED package structure. In the package method, by manufacturing the passivation layer with two layers in the process of manufacturing the OLED substrate, and the first layer is a regular silicon oxide layer, and the second layer is a silicon oxynitride layer, and the silicon oxynitride layer directly contacts with the seal, and the adhesion of the seal and the silicon oxynitride layer is stronger to promote the adhesion result of the seal and the OLED substrate for achieving the result of raising the seal package performance. In the OLED package structure of the present invention, similarly, the property of stronger adhesion of the seal and the silicon oxynitride layer is utilized to promote the adhesion result of the seal and the OLED substrate for achieving the result of raising the seal package performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.