Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant
US10044003B2 · kind B2 · utility
1Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2014 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Apr 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.