Encapsulated microbattery having terminal connected to active layer through a via
US10044009B2 · kind B2 · utility
3Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Nov 18, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an electronic device including a substrate, with an active layer stack on the substrate. A cover is on the active layer stack and has a surface area greater than that of the active layer so as to encapsulate the active layer stack. A conductive pad layer is on the cover. At least one conductive via extends between the active layer stack and the conductive pad layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.