Concentric vias and printed circuit board containing same
US10045435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2015 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Nov 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/429
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board comprising: i) a plurality of circuit board layers disposed in parallel planes to one another; ii) an outer via forming an electrical connection between a conductor contact on a first circuit board layer and a conductor contact on a second circuit board layer, wherein the outer via has a hollow central core; and iii) an inner via formed within the hollow central core of the outer via. The inner via forms an electrical connection between a conductor contact on a third circuit board layer and a conductor contact on a fourth circuit board layer. The inner via and the outer via are substantially concentric cylinders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.