Method of manufacturing a component
US10046412B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 2014 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Nov 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of manufacturing a component includes providing a powder layer; scanning the powder layer using an electron beam; detecting back scattered electrons produced by the interaction of the electron beam with the powder layer; identifying, from the detected back scattered electrons, any defects in the powder layer; selectively melting at least a part of the powder layer so as to generate a solid layer; and repeating these steps at least once so as to build up a shape corresponding to the component. The method may also includes steps of making a decision about whether to remove any identified defects in the powder layer, and adjusting one or more parameters of the step of providing a powder and/or adjusting one or more parameters of the selective melting step so as to avoid future recurring defects at that position based on stored data relating to the scanned powder layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.