Substrate for additive manufacturing
US10046524B2 · kind B2 · utility
2Cited by
0References
47Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | May 16, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A substrate for an additive manufacturing process, the substrate having a build surface for fusing to a part being formed on the substrate by the additive manufacturing process, wherein the substrate is configured to provide relatively high stiffness in a direction substantially perpendicular to the build surface, while having a low longitudinal stiffness in the plane of the build surface. Also, a method of forming the substrate, a system including the substrate, and use of the system for creating a part by an additive manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.