Epoxy resin composition, cured product, heat radiating material, and electronic member
US10047256B2 · kind B2 · utility
6Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2014 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | May 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides an epoxy resin composition including 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.