Patent · US Active

Resilient floor

US10047527B2 · kind B2 · utility

53Cited by
196References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 29, 2015
Grant dateAug 14, 2018
Priority date
Expiry dateDec 29, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49623
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A method of assembling resilient floorboards is disclosed that includes the step of bending an edge of a floorboard during the assembling. The bending reduces the force required for connection of the edge to another edge of a juxtaposed floorboard. The floorboards may be provided with a mechanical locking system for vertical and horizontal locking of two adjacent floorboards.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.