Resilient floor
US10047527B2 · kind B2 · utility
53Cited by
196References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2015 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Dec 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49623
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method of assembling resilient floorboards is disclosed that includes the step of bending an edge of a floorboard during the assembling. The bending reduces the force required for connection of the edge to another edge of a juxtaposed floorboard. The floorboards may be provided with a mechanical locking system for vertical and horizontal locking of two adjacent floorboards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.