Patent · US Active

Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors

US10048146B2 · kind B2 · utility

2Cited by
52References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 8, 2015
Grant dateAug 14, 2018
Priority date—
Expiry dateSep 1, 2036

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4908
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.