Photocathode and method for assembly
US10049848B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 10, 2016 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jun 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Technologies are described for methods for fabricating a film component. The methods may comprise sputtering a first film onto a substrate. The first film may include a semiconductor compound material. The semiconductor compound material may include a semi-metal material and one or more alkali material. The methods may further comprise evaporating a second film onto the first film. The second film may include the one or more alkali materials. The one or more alkali materials may catalyze crystallization of the semiconductor compound material in the first film substantially throughout the first film to form the film component in the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.