Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling
US10049895B2 · kind B2 · utility
0Cited by
21References
38Claims
0Family size
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Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Feb 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present teachings disclose various embodiments of a thermal block assembly having low thermal non-uniformity throughout the thermal block assembly. Accordingly, various embodiments of thermal block assemblies having such low thermal non-uniformity provide for desired performance of bioanalysis instrumentation utilizing such thermal block assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.